BGA Laser Reballing
BGA Reballing: The Most Advanced Laser Reballing Process
As part of Toyoshima Green Tech's IC harvest process, we also offer laser reballing. This provides a "reflow-less" manufacturing process by minimizing and localizing heat transfer to the IC.
As part of Toyoshima Green Tech's IC harvest process, we also offer laser reballing. This provides a "reflow-less" manufacturing process by minimizing and localizing heat transfer to the IC.
This laser process ensures our customers meet component manufacturer's requirements. Typically, no more than 3 reflow cycles are allowed.
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In order to generate the least amount of thermal stress, each Sphere is reflowed individually.
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Normal reballing occurs during a full reflow cycle.
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Laser reballing occurs in an isolated nitrogen atmosphere
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We prepare a spotless, sanitized environment to preform this process.
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Our process is completely repeatable and poses no risk of component damage in terms of component damage through thermal stress
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Process
Operation photo
