BGA Laser Reballing

BGA Reballing: The Most Advanced Laser Reballing Process

As part of Toyoshima Green Tech's IC harvest process, we also offer laser reballing. This provides a "reflow-less" manufacturing process by minimizing and localizing heat transfer to the IC. 

As part of Toyoshima Green Tech's IC harvest process, we also offer laser reballing. This provides a "reflow-less" manufacturing process by minimizing and localizing heat transfer to the IC. 

BGA Reballing
BGA Reballing Process PCB Board Chip Dallas Texas

This laser process ensures our customers meet component manufacturer's requirements. Typically, no more than 3 reflow cycles are allowed.

  1. In order to generate the least amount of thermal stress, each Sphere is reflowed individually.

  2. Normal reballing occurs during a full reflow cycle.

  3. Laser reballing occurs in an isolated nitrogen atmosphere

  4. We prepare a spotless, sanitized environment to preform this process.

  5. Our process is completely repeatable and poses no risk of component damage  in terms of component damage through thermal stress

Process

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Operation photo

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