Application Specific Balling and Reballing
Reballing BGAs with High Melting Point (HMP) Spheres
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High Melting Point Reballing process minimizes stand-off
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Improves mechanical consistency over a large operating temperature range
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This process may be used in high temperature situations
Reballing BGAs With Plastic Core Solder Balls
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Minimizes stand-off
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Lead free process
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Will produce a better path length and improve inductance control for RF/microwave circuits
Primary Ball Attachment of LGA/QFN/LCC Packages
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High melting point or plastic core solder balls
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Stand-off height will be increased.
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Mechanical integrity will be improved over a wide range of temperatures.
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Management of package will be improved to substrate TCE differences
Laser Balling on Specialist Substrates
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Prevents reflow by minimizing heat transfer to substrate.
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May be used on a variety of materials such as glass and other substrates.
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Specialized packaging
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Items can include medical devices as well as WLCSP and CSP products
