QFP Recovery

What Causes PCB to fail?

It is extremely important to recover ICs using a safe process. In order to do this, we must use non-abrasive processes which do not create reflow cycles or create reflow cycles. Our processes are greatly controlled and repeatable

Very few PCBs that fail are due to bad silicon. In actuality, a majority of failed PCBs are due to solder paste issues. Here at Toyoshima Green Tech, we are extremely thorough with our testing in order to get rid of any mechanical and electrical defects. 

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Our Process

Step 1

Moisture is removed from each PCB by prebaking them to JEDEC standard.

Step 2

The components are separated from the PCB board while avoiding normal reflow cycles on the IC. We process these boards at a far lower temperature (and shorter thermal cycles too). 

Step 3

Excess solder is removed from PCBs using a controlled process which conforms to industry standards

Step 4

Device is put through our Re-tinning process.

Step 5

The loose components recovered are intricately cleaned using an automated process. We take close care in measuring water cleanliness and perform a DI water rinse to these components as well.

Step 6

A scanner checks mechanical characteristics (ie. sweep and slant, lead deviation, pitch) of components.

Step 7

In order to ensure maximum performance of the component, we offer electrical testing which performs curve trace, functional testing, and programming to the component.

Step 8

We vacuum seal the components with desiccant to keep moisture out, before we properly label and ship them out.