Extreme Temperature Test

Mechanical and electrical properties of a component can be significantly affected by extreme temperatures. Properties affected include brittleness of ICs, frequencies, and electrical conductivity. Early life failure of electrical systems and unreliable operations can be caused by such temperature extremes.

For many highly reliable operating industries such as oil & gas, defense, or aerospace sectors, the vast amount of electrical components could be inexpensive to purchase but expensive to replace. This is because the components are remotely applied and downtime is expensive. As a result, temperature tests are critical for such applications.

In order to determine how ICs react to extreme temperatures, our system simulates:

Temperature Range: -150oc to +125oc

Temperature Accuracy: ± 0.1oc to ± 0.6oc
Rate of change: (According to IEC60068-3-5)
5.3oc/min Average Heating in Empty Chamber
4.2oc/min Average Cooling in Empty Chamber

Toyoshima Green Tech test systems fully comply with the MIL-STD 883 standard while meeting environmental testing requirements. Physical component specifications, length of true measurement and overall results of our temperature test is included in the report provided by Toyoshima Green Tech.

OPTION 1: Sample Test

In this test option, a sample from each batch of ICs will be selected and a temperature test will proceed to be conducted while an electrical check is simultaneously performed.

Process:

Step 1: IC is tested at Room Temperature

Step 2: The chamber is cooled down to -150°c and a second test is followed.

Step 3: The chamber is then set at room temperature once again and a third test is performed.

Step 4: The chamber is heated to +125°c and a fourth test is performed.

Step 5: All 4 test results are then compared.

ICs will be classified as a PASS if test reports are the same across the full temperature cycle. Alternately, ICs are classified as a FAIL if any section of the test has a different result from another.

OPTION 2: Soak Test

The sample test listed above is identical to the soak test. However, one difference is that when the chamber reaches the extreme temperature (-150 °c or +125°c), the temperature remains in the chamber for a set amount of time to allow the component to "soak" at that temperature before being tested.

Process:

Step 1: IC is tested at Room Temperature

Step 2: The Chamber is cooled down to -150°c, the IC is left in the chamber for a certain amount of time, and a second test is performed.

Step 3: The chamber is then set at room temperature, and a third test is performed.

Step 4: The chamber is heated to +125°c, and the IC left in the chamber for a certain amount of time, and a fourth test is performed.

Step 5: All 4 test results are then compared.

OPTION 3: Express Test

This test offered by Toyoshima Green Tech is different from the others because it is conducted on all ICs, as opposed to just a sample. The IC is held in cold storage (-150°c) and hot storage (+125°c) prior to being inserted into the test chamber. In order to decrease the duration of the sample test cycle, components are held in these extreme temperature zones prior to the test. As soon as the temperature of the test chamber has been achieved, we insert the device and begin testing the device's electrical characteristics in the extreme temperature environment. We compare these test results against control test results and a report is then produced by our engineers which encompass these visual inspection results pre-storage test and post storage test. This form of testing is cost-effective, reliable, and efficient.