Decapsulation of Plastic Molded Packages
Toyoshima Green Tech's automated etching system can perform decapsulation of plastic molded packages. Our secure etchback system allows us to look deeper at the die level. We use this technique in order to completely confirm or disprove of the authenticity of ICs.
High magnification analysis and decapsulation is used to check for surface damage on an IC. We check to make sure whether the die has been re-assembled or re-packaged in order to verify if physical damage or overstress has resulted in any sort of gross functional nonperformance or failure during IC tests.